In order to discover concealed weaknesses of electronic components, devices, and systems in the shortest possible time, test specimens must be subjected to multiple, abrupt fluctuating temperature changes.
With our Thermal Shock Test Chambers, extremely fast temperature changes ranging from -75 °C to +180 °C can be implemented. The aim is to check the behavior of the product when it undergoes these conditions. This allows you to reduce the incidence of early failures and increase the reliability of your products.
Standardized temperature stress tests according to
- MIL-STD-883H
- MIL-STD-810G
- EC-EN 60068-2
The heating and cooling rate is on average
15°C/min and the test chamber heat exchange rate is 255°C/min.
Thermal Shock Chambers are controlled by our own Software, using a PLC.
The Test Chamber is electrically transported from one chamber to another by a motorized worm gear drive system; this mechanism ensures a high transfer rate and significantly reduced vibrations as the sample is transported from one chamber to another. During the transfer, from the cold compartment to the hot compartment and vice versa for a large number of cycles, the sample is subjected to a thermal shock according to the set thermal profile temperatures.